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OKI partners with Dalian U on printer thermal engineering

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Hot bed of research: China's Dalian University of Technology is partnering with Japan's OKI Printing Solutions on printer thermal engineering
Hot bed of research: China's Dalian University of Technology is partnering with Japan's OKI Printing Solutions on printer thermal engineering
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OKI  research  printing - digital 
Japan's OKI Printing Solutions, a subsidiary of Oki Data Corporation and China's Dalian University of Technology are parterning to develop a printer thermal engineering tool.

The joint esearch laboratory will analyse the internal thermal printer environment in order to develop a thermal engineering tool.

Dalian University of Technology was established in 1949 and it is one of the most prestigious technological universities in China.

Based on its advanced technology, one of the key researches being undertaken by the Dalian University has been thermal analysis simulation.

In order to elevate this technology, it became necessary for collaboration with a company in order to gather actual data derived from developing commercialised products.

OKI Printing Solutions recognises the importance of thermal engineering at the printer design stage, based on accurate projection of internal heating.

The collaboration follows OKI Printing Solutions' pressing need for an optimum thermal engineering environment for colour LED printers: partnering with a developer who utilises high thermal analysis simulation technology such as Dalian could bring about such a breakthrough.

Based on thermal analysis results obtained with conventional simulation software, it was difficult to set simulation conditions due to the change in heating values of the parts. This was caused by the change in the flow of air which depends on the apparatus environment.

Thus, there were discrepancies between results obtained from simulation and those obtained from printers, leading to increased lead time.

Mikihiko Maeno, CEO and president of Oki Data Corporation, syas, "Under the joint research, we will develop a 'one-spin thermal engineering' environment which will enable completion of heat engineering only by simulation processing, without the use of prototypes. This will shorten the time to market a product by 15 per cent.

"We are committed to providing valued-added products and services to our customers. At the same time, we will continue to work closely with the people in China to contribute to the development of China."


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